发明名称 |
Semiconductor device |
摘要 |
A semiconductor device formed on a semiconductor chip (1) comprises a plurality of first bonding pads (3a, 3d) for receiving an identical external signal, an internal circuit (8) connected to any one of the plurality of the first bonding pads, a second bonding pad (11) for receiving a control signal from outside the semiconductor chip, and a bonding pad selection switch (19) for selecting a bonding pad out of the plurality of first bonding pads and connecting it to the internal circuit in response to the control signal supplied thereto through the second bonding pad.
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申请公布号 |
US4808844(A) |
申请公布日期 |
1989.02.28 |
申请号 |
US19870032624 |
申请日期 |
1987.04.01 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OZAKI, HIDEYUKI;HIRAYAMA, KAZUTOSHI;FUJISHIMA, KAZUYASU;HIDAKA, HIDETO |
分类号 |
H01L21/60;H01L21/822;H01L23/64;H01L23/66;H01L27/04;(IPC1-7):H04Q9/00;H03K17/693;H03K17/16;H03K5/01 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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