| 摘要 |
PURPOSE:To obtain the title board, which maintains a superior voltage resistance and superior heat dissipation characteristics and has an improved moisture resistance and an improved adherence, by a method wherein an Al-family metallic heat dissipation substrate subjected to a specified rough surface treatment on its adhesive surface side is laminated on one surface of a metallic foil through a heat-dissipative insulating moisture-resistant layer formed of a specified thermosetting resin composition and is formed integrally with the metallic foil. CONSTITUTION:An Al-family metallic heat dissipation substrate 40 is laminated on one surface of a metallic foil 20 through a heat-dissipative insulating moisture-resistant layer 30 and is formed integrally with the foil 20. In such a circuit board 10, the layer 30 is formed of a thermosetting resin composition, which contains a thermosetting resin and the 20-300 parts weight of an inorganic filler obtainable by performing a coating treatment on the 100 weight part of the thermosetting resin with an Si coupling agent and/or a titanate coupling agent add is in a semihardened state. The substrate 40 is subjected to rough surface treatment of 1mum or more on its adhesive surface side. Moreover, the foil 20 is also subjected to rough surface treatment of 1mum or more, for example, on one surface thereof, an epoxy resin is used as the above thermosetting resin and the rough surface treatment to the substrate 40 is performed in 2-15mum. |
