PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT,申请号JP19870206909-传众专利搜索

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发明名称	PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要
申请公布号	JPS6450450(A)	申请公布日期	1989.02.27
申请号	JP19870206909	申请日期	1987.08.20
申请人	TOSHIBA CORP	发明人	SHIMADA OSAMU;SUDO TOSHIO
分类号	H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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