| 摘要 |
PURPOSE:To avoid adhering between a ceramic wiring board and a base plate at the time of baking, by forming a dummy wiring pattern with a small gap from the wiring pattern, on the surface of the ceramic wiring board mounted on the base plate at the time of baking, the surface being in contact with the base plate. CONSTITUTION:By screen printing method, tungsten paste is used, which is filled in through holes on a green sheet subjected to through hole working, and a wiring pattern is formed on the green sheet. At this time, small gaps 8 are made around the wiring pattern 2', and a dummy wiring pattern 9 is spread. Successively, the above sheets are stacked, mounted on a base plate 6 constituted of an alumina formation ceramic plate and a molybdenum plate or a molybdenum mesh, and subjected to baking. Since adhering between the ceramic wiring board and the base plate at the time of baking is caused by the exposed parts of the ceramic wiring board, the dummy wiring pattern 9 is so arranged that the exposed ceramic part 7 on the ceramic wiring board surface is made as small as possible. |
