| 摘要 |
PURPOSE:To obtain a photomask jig whose size is not changed with the passage of time and whose durability is high by a method wherein a circuit pattern of a metal film is formed on bonding faces of a pair of glass sheets which are positioned and bonded via a base material. CONSTITUTION:A Cr thin film 12 is formed on a glass sheet 10 where a through hole 11a to be used for a coarse alignment pin 17 during a bonding operation, a through hole 11b to be used of a positioning pin 18 of a base material 21 to be used as a printed-circuit board and a reference hole 11c for a circuit pattern have been formed; after that, a photosensitive resist film 13 is formed and is exposed to light so that a prescribed circuit pattern can be obtained. Then, this assembly is developed and etched; the resist film 13 is removed; a pair of photomask jigs 15 where prescribed Cr patterns 16 have been formed are obtained. The coarse alignment pins 17 and the positioning pins 18 are inserted and fixed at one jig 15; the upper jig and the lower jig 15 are connected by using hinges 19 in such a way that these jigs can be opened and closed. When the substrate 21 is exposed to light, the substrate 21 is fixed between the upper jig and the lower jig 15; whereby it is exposed to light from both faces. |
