| 摘要 |
PURPOSE:To reduce a thermal resistance and facilitate higher output performance by a method wherein the circumference of one of jumet wires is expanded while one side or a part of an arc of its region soldered to the other jumet wire is kept in the same plane as the other jumet wire. CONSTITUTION:The circumference of a jumet wire 1a is expanded to left, right and upper directions while only one side of its region soldered to the other jumet wire 1 is kept in the same plane as the other jumet wire 1. As the soldered area between the jumet wire 1a and the conductor on a printed board is expanded, the thermal resistance from a semiconductor element 3 to the printed board can be reduced. Moreover, only one (1a) of the jumet wires is expanded, a parallel capacitance which causes a problem in a radio frequency range is not increased. With this constitution, the higher output performance can be realized. |
