| 摘要 |
<p>Co-sinterable metal-composite packages are described as well as methods for their production. The composite portion, for dielectric properties, is composed of a mixture of crystalline ceramic material and glassy ceramic material; upon co-firing, the relative amounts of crystalline and glassy portions remain essentially constant. The dielectric portion can be fabricated by mixing crystalline powders and glass frit; alternatively, a sol-gel coating method can be used to create a composite powder (i.e., crystalline particles coated with glassy components). The metallization portion is generally copper, silver/palladium, or gold. For fabrication by tape casting methods, a polymeric binder which decomposes (such as a methacrylate) rather than burns out (such as polyvinyl butyral) is used; this is essential when a neutral or reducing atmosphere is used to avoid oxidation of the metal used for circuit paths during sintering. An advantage is that the packages are co-fireable at temperatures of less than about 1000°C; the packages also show good electrical and physical properties.</p> |
