发明名称 |
PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD FOR ITS PRODUCTION |
摘要 |
A package for a semiconductor device comprising three laminated ceramic sheets: a first sheet provided with a chip stage on the upper surface thereof, a second sheet provided with a first chip-inserting window for exposing the surface of the chip stage and provided with an internal conductor pattern formed at least on the upper surface thereof; and a third sheet provided with a second window for exposing the first chip-inserting window and for exposing a wire-bonding area located adjacent to the periphery of the first chip-inserting window, characterized in that marks for recognizing the location of the first chip-inserting window are essentially aligned, this alignment being effected in that the first chip-inserting window and marks for recognizing the location of the first chip-inserting window are simultaneously formed with the same mold, the marks for recognizing the location of the first chip-inserting window being formed in the wire-bonding area of the second green sheet. |
申请公布号 |
DE3279378(D1) |
申请公布日期 |
1989.02.23 |
申请号 |
DE19823279378 |
申请日期 |
1982.11.05 |
申请人 |
FUJITSU LIMITED |
发明人 |
KOJIMA, HARUO;AKASAKI, HIDEHIKO |
分类号 |
H01L21/52;H01L21/50;H01L21/58;H01L23/057;H01L23/08;H01L23/498;H01L23/544;(IPC1-7):H01L21/50;H01L23/04;H01L23/48 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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