| 摘要 |
PURPOSE:To eliminate the halation of a hard mask by immersing an Ni-P mask into a sodium hypophosphite, soln., then plating the same by an electroless plating liquid contg. hydrazine. CONSTITUTION:After an Ni-P film is formed on a transparent substrate by electroless plating, the film is patterned by photolithography. This substrate is then immersed into 0.1-1.0mol./l sodium hypophosphite soln. and is thereafter immersed into the electroless plating liquid (A) contg. the hydrazine as a reducing agent so that only the patterned parts are replated. NiSO4, sodium citrate, etc., may be incorporated in addition to the hydrazine into the plating liquid A. The black metallic film having good adhesion is then formed on the substrate and, therefore, the photomask free from halation is obtd. |
