发明名称 |
PLASTIC MOLDED CHIP CARRIER PACKAGE AND METHOD OF FABRICATING THE SAME |
摘要 |
A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member molded of a plastic material to which are integrally embedded a plurality of I/O pins and a conductor member for interconnection between the terminals of the chip and the corresponding I/O pins to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs which project in the same direction of the I/O pins for abutment against a printed circuit board for mounting the package in a spaced relation thereto with the I/O pins plugged into metallized through holes provided in the board. A method of fabricating the plastic chip carrier package is also disclosed to comprise the steps of placing a plurality of I/O pins into corresponding vertical slots formed in a molding die with the top portion of the I/O pins projecting above the molding die surface; supporting a conductor member on the I/O pins with the distal top ends of the I/O pins extending into correspondingly through holes formed in the conductor member, the conductor member including a plurality of conductor lines for electrical interconnection between the individual I/O pins and the terminals of the chip; and filling a molten plastic material at least between the conductor member and the molding die surface and solidifying the same so as to form thereat a plastic carrier member to which the conductor member is integrally embedded together with the top portions of the I/O pins. |
申请公布号 |
EP0232837(A3) |
申请公布日期 |
1989.02.22 |
申请号 |
EP19870101455 |
申请日期 |
1987.02.03 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HIRATA, ATSUOMI;MAMIYA, HIROKUNI |
分类号 |
H01L21/56;H01L23/31;H01L23/498;H05K3/30 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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