PACKAGE FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To increase a device of this design in number of pins and also improve it in moisture resistant and heat dissipating properties by a method wherein leads are formed in one piece with a resin substrate through an insert molding in such a manner that tips of them are positioned at the peripheral section of a resin substrate surface and a part of the surface of their chips is at least partially exposed from the resin substrate surface, and an internal circuit pattern section is formed on the surface of the resin substrate which surrounds a semiconductor element mounting section. CONSTITUTION:A resin substrate 30 and a lead frame 32 are formed into one piece by making lead 38 tips of the lead frame 32 be inserted into a mold. In this process, at least a part of the lead 38 tips is so set as to be exposed from the resin substrate 30 to be connected with an internal circuit pattern section 48. A flange section 46 extending outward is provided to a base of a heat sink 44 which is formed through an insert molding so as to bury its base in the resin substrate 30 in one piece, where the flange section 46 prevents moisture from infiltrating through the interface between the heat sink 44 and the resin substrate 30. The internal circuit pattern section 48 is formed in such a manner that a copper foil is adhered onto a heat resistant resin sheet and incorporated in with the lead frame 32, performing a position alignment and a tine pattern is transferred on the surface of the resin substrate 30 which is formed by injecting resin into the mold.