RESIN-SEALING EQUIPMENT FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To suppress the development of resin burrs in a lead frame between chase blocks during a sealing process by a method wherein the sections of chase blocks held by heater blocks are constituted of a plurality of teeth capable of elastic deformation in the direction of pressure. CONSTITUTION:Upper and lower chase blocks 21 and 22 provided with cavities 21a and 22a for the formation of packages 5 and 6 are held by heater blocks 3 and 4. The chase blocks 21 and 22 are held by the heater blocks 3 and 4 through the intermediary of teeth 23 and 24 capable of elastic deformation in the direction of pressure. The teeth 23 and 24 are parallelly lined up in one direction with a prescribed gap between them, positioned outside the cavities 21a and 22a, and capable of 30-80mum elastic deformation in cross section area or height during a closing process. This design prevents the chase blocks 21 and 22 from warp during a sealing process for a close contact between parting members and realizes a uniform pressure on the parting surfaces of the chase blocks 21 and 22.