发明名称 MANUFACTURE OF RESIN SEAL TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to control the thickness of a thin resin layer beneath a substrate retainer in a uniform thickness with high accuracy, by retaining a substrate retainer serving also as a heat radiating plate at least at three points, and performing resin sealing. CONSTITUTION:An external lead 6 is formed in a body with a substrate retainer 2. Two thin stripes 15, 16 unified in a body with the substrate retainer 2 extend from the opposite side to a side linking to the external lead 6 of the substrate retainer 2. These are linked with a second common connection stripe 17. The thickness of thin stripes 15, 16 is made thinner than that of the substrate retainer 2, and a step-difference is formed between the lower surface of the stripes and that of the substrate retainer 2. Therefore, the substrate retainer 2 is retained at three points by the external lead 6 and the two thin stripes 15, 16. Thereby, even if resin 30 is injected into gaps of metal molds 13, 14 with high pressure, inclination and tortion of the substrate retainer 2 do not generate, and the thickness of a resin layer just under the substrate retainer can be controlled very exactly so as to be thin and uniform.
申请公布号 JPS6446942(A) 申请公布日期 1989.02.21
申请号 JP19880158577 申请日期 1988.06.27
申请人 MATSUSHITA ELECTRON CORP 发明人 FUJII HIROYUKI;TATENO KENICHI;NISHIKAWA MIKIO
分类号 H01L21/56;H01L23/28;H01L23/48 主分类号 H01L21/56
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