| 摘要 |
PURPOSE:To provide a semiconductor optical element package which can be assembled through automated processes without, causing positional deviation before or after the assembly and which is freed of positional deviation for a long period of time after fixing components, by regulating positions of a base member in which an optical fiber is fixed and of a pedestal member carrying a semiconductor optical element thereon while contacting them with each other before fixing them. CONSTITUTION:A semiconductor optical element package comprises a package base member 4 having a through hole receiving an optical fiber 2, and a pedestal member 4 carrying a semiconductor optical element 1 thereon. These members have a common plane and they can be slid on the plane with respect to each other so as to regulate the relative positions thereof, and they are fixed at the positions where a maximum optical coupling efficiency can be obtained between the semiconductor optical element 1 and the optical fiber 2. They may be fixed by laser welding, for example. Accordingly, the assembling processes of the package can be automated easily without causing positional deviation during these processes. Further, the package is freed of positional deviation which would be conventionally caused by creeping of a fixing material, for a long period of time after fixing the members. Thus the package is allowed to have high reliability. |
