| 摘要 |
A forced air, ambient temperature, evaporator coupled to an electroless copper plating bath and to a purification system for replenishing and maintaining the stability of the plating bath, which bath tends to become depleted as the result of the reduction of water soluble cupric salt in an alkaline solution under copper plating and reducing conditions and in which the rate of evaporation of water from the surface thereof is insufficient to preclude growth in the volume thereof resulting from liquid additions thereto required to replace consumed constituents, thus giving rise to a need for bailout to prevent overflow thereof, solves the following problems: evaporation is independent of plating bath geometry; very high evaporation rates enable bailout to be zero at all plating loadings and plating thicknesses; the high evaporation rates provide sufficient cooling whereby the electroless copper solution can be introduced directly to the purification system with no additional cooling; dragout losses may be completely eliminated; and the large amount of air blown through the electroless copper solution of the plating bath enhances stability by lowering the bath temperature, saturating the bath with stabilizing oxygen, and purging the bath of destabilizing waste hydrogen waste product.
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