发明名称 |
MICROELECTRONICS APPARATUS AND A METHOD OF INTERCONNECTING WIRING PLANES |
摘要 |
<p>A MICROELECTRONICS APPARATUS AND A METHOD OF INTERCONNECTING WIRING PLANES A microelectronics apparatus and a method of fabricating customized connections between wiring planes superposed on a substrate is disclosed. A first wiring plane having multiple conductors is formed upon the substrate. An insulating layer is formed that overlies and electrically insulates the first wiring plane. A second wiring plane having multiple conductors is formed above the insulating layer by forming multiple conductors that are electrically connected to the first wiring plane with selected conductors of the first wiring plane being electrically connected to selected conductors of the second wiring plane. The connections may be modified by breaking selected ones of the electrical connections between the first and second wiring planes to customize the electrical interconnections.</p> |
申请公布号 |
CA1250372(A) |
申请公布日期 |
1989.02.21 |
申请号 |
CA19860519098 |
申请日期 |
1986.09.25 |
申请人 |
MICROELECTRONICS CENTER OF NORTH CAROLINA |
发明人 |
REISMAN, ARNOLD;OSBURN, CARLTON M. |
分类号 |
H01L21/3205;H01L21/48;H01L21/82;H01L23/52;H01L23/538;H05K1/00;(IPC1-7):H01L27/02;H01L21/70 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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