发明名称 SUBSTRATE HAVING GOOD THERMAL CONDUCTIVITY
摘要 PURPOSE:To obtain an excellent substrate having good thermal conductivity, by forming a metallic plate from an alloy containing either of molybdenum and tungsten. CONSTITUTION:The surface of a metallic plate 11 containing at least either of molybdenum and tungsten is roughened to form a nickel plating layer 12 as a brazing ground material and a tinning layer 13 as a brazing material is then formed on the surface thereof. On the other hand, the surface of a ceramics plate 21 is similarly roughened to form a copper plating layer 22 as a metallized metallic layer by electroless copper plating. A nickel plating layer 23 as a brazing ground is then formed on the surface of the copper plating layer 22 and a tinning layer 13 is subsequently formed on the surface thereof. The two plate members are opposed with the tinning layers 13, superposed and heated at the melting point of the tinning layers 13 which are the brazing material or above to braze and join the metallic plate 11 to the metallized ceramics plate 21. After brazing, the whole is quenched to complete the aimed substrate having good thermal conductivity.
申请公布号 JPS6445782(A) 申请公布日期 1989.02.20
申请号 JP19870200494 申请日期 1987.08.11
申请人 TAMURA SEISAKUSHO CO LTD 发明人 ABE YOSHINOBU;SUZUKI YUKIHARU
分类号 B23K1/19;C04B37/02;H05K1/05 主分类号 B23K1/19
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