| 摘要 |
PURPOSE:To make it possible to obtain excellent flexing characteristics by applying a throughhole plating in the non-flexing part, and thereafter etching away the copper foil on the part corresponding part of one surface of the base film part which becomes the flexing part simultaneously with the circuit formation. CONSTITUTION:A bonding film in a B-stage condition is laminated to an insulating base film 1 which is soft and has a high flexibility, a rolled copper foil 3 is laminated thereon, onto the rear thereof, a bonding film 4 in a B-stage condition is laminated except the flexing part, and a rolled copper foil 5 is laminated thereon. Thereafter, in the non-flexing part, a throughhole 6 for connecting the circuits of both surfaces is provided in a predetermined position, and a throughole plating is applied to the part except the flexing part to form a throughole plating layer 7. A circuit is formed in the flexing part side A, but the copper foil 4 on the flexing A' is totally etched to expose the base film 1. And a film cover lay 9 coated with a bonding agent 8 is laminated to the surface side. With this set-up, the flexibility can be improved. |
