| 摘要 |
PURPOSE:To reduce the cost of a semiconductor device by composing a frame for preventing resin from flowing out of paste-like substance formed on a substrate. CONSTITUTION:A semiconductor chip 2 for forming an LSI is placed on a flat substrate 1 in which its surface is formed, for example, of glass epoxy or triazine. A frame 5 made, for example, of silicon rubber paste for preventing resin from flowing out is provided on the substrate 1, has, for example, a triangular sectional shape, and the chip 2 and wirings 3 are sealed with resin 6, such as epoxy resin in the frame 5. When the frame 5 for preventing the resin from flowing out is composed of the paste in this manner, works of mechanical working and bonding for forming the frame 5 are eliminated. Further, since the substrate 1 having a flat surface is employed, a working for forming a cavity is obviated. Thus, the substrate 1 becomes inexpensive, and hence the cost of the package can be reduced. |
