| 摘要 |
PURPOSE:To prevent a malfunction due to a distortion stress generated by the warpage of a printed wiring substrate, by clamping using conductive rubber and pressing them by mounting fittings, a hybrid integrated circuit having input/ output terminal electrodes and the substrate having external connection electrodes. CONSTITUTION:A hybrid integrated circuit 1 is so bonded to a printed circuit substrate 4 as to mechanically resilently and electrically conduct therebetween. That is, if conductive rubber 6 is compressed fixedly, the rubber has elasticity even in this state, and the connection of the conductive section proves its connecting reliability by exhibiting sufficient countermeasure for slight dimensional change. Then, the hybrid integrated circuit, the rubber and the substrate are sequentially superposed in this order, integrated by mounting fittings 9, and electrically and mechanically secured. In this case, the rubber is compressed without saying. Thus, it can prevent a malfunction due to a distortion stress generated by the warpage of the substrate. |
