| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit device which can reduce the floating capacity of the periphery of a bonding pad and an influence to a peripheral element by providing a groove on a substrate at the peripheral position of a connecting part to be connected to an external circuit device. CONSTITUTION:A groove 2 is formed on a substrate 4 at the peripheral position of a bonding pad 1, capacities 6, 9 are thereby reduced, and the series resistance value of resistors 7, 8 is increased. Thus, the attenuation of a signal input to the pad 1 is reduced, and a noise generated at the whole substrate 4 is decreased. Since the capacity 9 is reduced and the resistance 7 is increased, an influence of the signal input to the pad 1 to a resistance element 5 can be decreased. Further, an impedance between the element 5 and the pad 1 is increased, and the influence of the signal input to the pad 1 to the element 5 can be decreased. Thus, the frequency characteristic of an ultrahigh speed semiconductor integrated circuit device is improved, and the influence of an external signal as one of noise generation sources can be eliminated. |
