A method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby.

摘要

The invention provides a very efficient and reliable method for electrically connecting the electrodes of an electronic device, e.g., IC chips (1), and the electrodes of, for example, a glass-made circuit board substrate (3) with good repairability. Thus, the electrodes of the IC chip are first coated each with an electroconductive thermally meltable adhesive resinous composition (2) to form a resinous bump, the IC chip is mounted on the substrate with the adhesive-coated electrodes contacting with the respective electrodes of the substrate, and remelting and then solidifying the resinous bumps so that the electrodes are bonded and electrically connected together. As compared with the conventional methods in which an electroconductive thermosetting resinous composition is used for the bumps on the electrodes, the electrical connection can be obtained with a smaller thermal effect and good replaceability of the IC chip found unacceptable with an acceptable one.