| 摘要 |
PURPOSE:Not to leave any air in resin layers preventing any void or crack from occurring by a method wherein a hole or a notch for resin shifting is made in a bonding part and radiating sheet of a semiconductor element in a lead frame. CONSTITUTION:A hole 7 or a notch 8 for resin shifting is made in a bonding part and radiating sheet 1 of a semiconductor element. Consequently, even if the resin injecting speeds into the element side in wide metallic mold space wherein a thick resin layer of the bonding part and radiating sheet 1 is formed as well as into the element side in narrow metallic mold space wherein a thin resin layer of said sheet 1 is formed are different from each other, the resin can be shifted very rapidly through the hole 7 or the notch 8 in the shifting part provided in the bonding part and radiating sheet 1 in the metallic mold space. Through these procedures, the resin layers can be formed simultaneously both in the element side and the inverse element side so that the air inside the metallic space is pushed outside to prevent any void or crack from occurring. |
