发明名称 COPPER ALLOY FOR LEAD WIRE MATERIAL OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a lead wire material having suitable characteristics, particularly excellent adhesion of plating by defining respective components of copper- nickel-zinc alloy and limiting amounts of diversified kinds of sub-components to be mixed. CONSTITUTION:An alloy consisting of nickel of 1.5-10wt%, zinc of 5-20wt%, oxygen of 0.0020wt% or less and remainder consisting of copper and inevitable impurities is used, or an alloy consisting of one or more metals in total weight of 0.001-2.0wt% selected from phosphorus of 0.001-0.1wt%, tin of 0.01-1.0wt%, iron of 0.005-1.0wt%, cobalt of 0.01-1.0wt%, chromium of 0.01-1.0wt%, aluminum of 0.01-1.0wt%, magnesium of 0.01-1.0wt%, manganese of 0.01-1.0wt%, titanium of 0.01-1.0wt%, zirconium of 0.01-1.0wt% and beryllium of 0.01- 1.0wt% and remainder consisting of copper and inevitable impurities are used.
申请公布号 JPS5947751(A) 申请公布日期 1984.03.17
申请号 JP19820158212 申请日期 1982.09.13
申请人 NIPPON KOGYO KK 发明人 KAWAUCHI SUSUMU;TSUJI MASAHIRO;YAMAMOTO MICHIHARU
分类号 C22C9/00;C22C9/04;H01L23/48;H01L23/49 主分类号 C22C9/00
代理机构 代理人
主权项
地址