发明名称 |
Electroless gold plating solution |
摘要 |
An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions. |
申请公布号 |
US4804559(A) |
申请公布日期 |
1989.02.14 |
申请号 |
US19870091457 |
申请日期 |
1987.08.31 |
申请人 |
HITACHI, LTD. |
发明人 |
USHIO, JIRO;MIYAZAWA, OSAMU;YOKONO, HITOSHI;TOMIZAWA, AKIRA |
分类号 |
C23C18/44;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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