发明名称 |
Method of manufacturing an electric component with a lead wire secured in a through hole |
摘要 |
To manufacture an electronic component of the present invention and according to a method of manufacturing the electronic component also of the invention, steps of positioning and temporarily fixing the electronic component element are performed by the use of a bent portion formed on the lead wire, the bent portion of the lead wire being pressed into the through hole of the electronic component element. Thereafter, the bonding agent, which was applied to the bent portion, is filled into the through hole of the electronic component element by capillarity. Alternatively, the bonding agent may be injected into the through hole after the lead wire is inserted. Thus, the bonding agent is filled in a shorter time.
|
申请公布号 |
US4803777(A) |
申请公布日期 |
1989.02.14 |
申请号 |
US19850762963 |
申请日期 |
1985.08.06 |
申请人 |
NAKAGAWA, MASAYUKI;TABUCHI, MAKOTO;HAMURO, MITSURO |
发明人 |
NAKAGAWA, MASAYUKI;TABUCHI, MAKOTO;HAMURO, MITSURO |
分类号 |
H01F17/04;H01F27/02;(IPC1-7):H01R43/00 |
主分类号 |
H01F17/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|