| 摘要 |
An in-line solder extractor and a tubular heating assembly for use therewith having a tubular tip disposed within the tubular heating assembly a hollow handle, the heater assembly being mounted with respect to the forward portion of the handle a solder collection chamber disposed within the handle, and forward and rearward seals for sealing the forward and rearward ends. The heater assembly includes a tubular sleeve; a tubular heating element support member mounted within the tubular sleeve and extending rearwardly of the tubular sleeve, a heating element disposed along heating element support member; and a hollow, cylindrical, seal mounting member coaxially mounted on the tubular heating element support member for mounting the forward seal of the solder collection chamber and for spacing the seal from the tubular sleeve and the tubular heating support member so that the rearward portion tubular heating support member may be raised to at least solder melting temperature to lessen the possibility of the solder clogging the support member while, at the same time, the seal is exposed to a temperature less than the last-mentioned temperature to thus promote the longevity thereof.
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