| 摘要 |
A cleaning unit for cleaning the tip of a soldering iron or solder extractor or the like, the unit including a well for containing a liquid which will shock surface oxides from the tip; a sponge disposed within the well for absorbing the liquid, the sponge having an opening extending therethrough; and a nonmetallic, preferably porous liner in contact with the surface of the opening in the sponge, the nonmetallic liner having an abrasive surface whereby particulate matter may be removed from the tip by the abrasive surface by rubbing the tip thereagainst and said surface oxides may be removed by being brought into contact with the liquid absorbed in the sponge.
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