| 摘要 |
<p>PURPOSE:To satisfactorily execute the bonding of a case member and electronic parts by covering the surface of adhesives with a heat melting type adhesives. CONSTITUTION:A transfer head 50 is heated up to a prescribed temperature by a heater, the transfer head 50 is descended by an elevating device, and a transfer sheet 40 is pressured from the upper direction with the transfer head 50 and press-bonded to the bottom of a lower part case 1. Heat melting type adhesives 43 are cooled and hardened and the heat melting type adhesives 43 are press-bonded to the lower part case 1. Further, after that, the transfer head 50 is pulled up by the elevating device. Thus, room temperature type adhesives 42 are separated from a base sheet 41 through a release agent 41a, and at the bottom of the lower part case 1, lamination type adhesives 15 composed of the heat melting type adhesives 43 and the room temperature type adhesives 42 corresponding to respective pressuring parts 51 of the transfer head 50 are transferred.</p> |
