| 摘要 |
<p>PURPOSE:To increase a surface insulation resistance between wiring patterns, by etching a conductive layer piled on an insulation substrate to form conductor patterns and next etching a surface phase of the insulation substrate exposed between the conductor patterns. CONSTITUTION:A conductive layer piled on an insulation substrate by vacuum evaporation, sputtering, plating, or the like is etched to form conductor patterns, and next a surface phase of the insulation substrate between the conductor patterns is etched by a wet type etching liquid or by gas plasma. Since various conductive impurities formed between the conductor patterns upon the piling of said conductive layer can be removed in this way, surface insulation resistance between the conductor patterns can be increased.</p> |
