| 摘要 |
<p>Process for manufacturing printed circuit boards in which a radiation curable material (10) is applied to a substrate (14), the material (10) is exposed to radiation and developed to expose those regions where a first conductor circuit pattern is to be formed. The covered substrate is plated and/or sputtered with a metal (24). A second layer of curable material (18) is processed like the first one, and a second metal is plated onto those regions of said electrolessly plated and/or sputtered metal coating (24) where said circuit pattern (32) is to be formed. The second metal (32) forms the remainder of said first conductor circuit pattern (32). These steps are repeated to form additional conductive circuit patterns.</p> |
