| 摘要 |
<p>This invention relates to a method of measuring contact stress on a contact surface of a thin sheet (mainly up 2 to 3 mm thick) in contact with other solid by utilizing a sheet wave available in one of the ultra-sonic modes. A probe is brought into contact with the thin sheet, an ultrasonic wave is projected to the thin sheet from the probe to generate the sheet wave, the resulting sheet wave is propagated through the thin sheet and passed through the contact surface and the contact stress is measured by use of the sound pressure of the passing sheet wave as an index of evaluation. It becomes thus possible to measure the contact stress between the thin sheet and other solid, which has been measured conventionally only by dipping the thin sheet into a liquid tank, without using the liquid tank, both statically and dynamically, quantitatively, rapidly and moreover on a real time basis.</p> |
