PACKAGING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT,申请号JP19870195506-传众专利搜索

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发明名称	PACKAGING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT
摘要
申请公布号	JPS6439100(A)	申请公布日期	1989.02.09
申请号	JP19870195506	申请日期	1987.08.05
申请人	SEIKO EPSON CORP	发明人	MIZOBE SUMIO
分类号	H01L23/28;H05K9/00	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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