发明名称 METHOD AND APPARATUS FOR FORMING A SUBSEQUENT METALLIZATION PATTERN ON A CERAMIC SUBSTRATE
摘要 <p>This invention concerns method and apparatus for making a mask conforming to a cured MLC substrate. The mask when made may be used to add layers of metallization to the cured substrate by conventional photolithographic techniques. The method and apparatus feature use of the cured substrate itself to pattern the mask. Particularly, the substrate is aligned with the unpatterned mask and the image of the substrate transferred to the mask such that once patterned, the mask may subsequently be realigned with the substrate. In preferred form, a system of notches and grooves are used to align the substrate and mask and a lens system used to transfer the substrate image to the mask. The invention also includes method and apparatus for making an improved MLC substrate. The improvement is characterized by the use of photolithographic techniques to add successive layers of metallization to the cured substrate. This is accomplished by use of a special fixture for combining and aligning the cured substrate with a conforming mask.</p>
申请公布号 EP0103671(B1) 申请公布日期 1989.02.08
申请号 EP19830103812 申请日期 1983.04.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AMENDOLA, ALBERT;CHRISTENSEN, RICHARD GILBERT;YEREANCE, JOHN GERALD, JR.
分类号 H05K3/00;G03F1/00;G03F7/20;G03F9/00;H01L21/027;H01L21/30;H01L21/48;H05K3/14;H05K3/24;(IPC1-7):H01L21/48 主分类号 H05K3/00
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