Thin film deposition process.

摘要

A thin film deposition process comprises the steps of providing a first target area on a magnetron electrode, sputtering particles from said area so that they fall onto a heated substrate body for forming the required deposit, simultaneously operating a sputtering gun such that further particles are dislodged from a second target area and directed towards the substrate, the two resulting particle plasmas mixing at the substrate surface such that a deposit of a predetermined chemical composition is produced. This allows a multicomponent material such as a PLZT ceramic to be deposited without a change in composition due to different volatilities etc. of the components.