发明名称 COOLING METHOD AND APPARATUS FOR SUBSTRATE FOR APPLYING CHEMICAL BEING HEATED AND DRIED
摘要 PURPOSE:To accelerate the speed of cooling, and to improve the working ratio of a drier by bringing a substrate, on which a photo-resist is applied, into contact with a cooling plate with a cooling hole, through which a revrigerant is passed in order to cool the substrate, and an adsorbing hole adsorbing the substrate under vacuum when the substrate must be cooled in order to equalize the thickness of an applying liquid. CONSTITUTION:A plurality of the mutually parallel cooling holes 2 in the front and rear direction are penetrated to the cooling plate 1, the same terminals of adjacent cooling holes 2 are connected mutually by U-shaped connecting pipes 3, and each cooling hole 2 is connected in series. A solenoid valve 4 is fitted at the front end of the cooling hole 2, the valve 4 is connected to a cooling source not shown, the valve 4 is operated by a temperature sensor 5 buried at the central necessary section of the upper surface of the cooling plate 1 and a controller 6, and the flow rates of cooling water and the refrigerant such as a calcium chloride solution are adjusted. A plurality of communicating holes 8 are formed to the upper section of the cooling holes 2, and a large number of the attracting holes 7 opening to the upper surface are bored to the ends of the holes 8, thus attracting the substrate 9. Accordingly, the drying rate of the substrate 9 washed for the application of the resist is accelerated.
申请公布号 JPS5948925(A) 申请公布日期 1984.03.21
申请号 JP19820159879 申请日期 1982.09.14
申请人 DAINIHON SCREEN SEIZOU KK 发明人 OOKAMI NOBUTOSHI;NISHIZAWA HISAO
分类号 H01L21/027;G03F7/16;(IPC1-7):01L21/30 主分类号 H01L21/027
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