| 摘要 |
PURPOSE:To make the rapid locating with high precision easier realizing the unmanned bonding process by a method wherein a lead and a solid element may be connected by means of a bonding wire while attracting and holding a stem. CONSTITUTION:A manifold 21 supplying a vacuum cylinder 18 with vacuum pressure 201 to adsorb and fix a stem 1 is provided between the vacuum cylinder 18 and a rotating shaft 19. The stem 1, being carried up to a bonding device 16 by means of a sleeving unit 29 and a cam 29, is constantly lifted upward by a raising spring containing the vacuum cylinder 18 or a servomotor 20 with its position finally located by the surface of the cam 29. The cam 29 comprising a bonding head, a stem rotating unit, thus forming a sequence may be driven by a driving shaft 34. |
