| 摘要 |
PURPOSE:To prevent a short circuit with a wire by a method wherein an insulating film for surface protection use installed on a semiconductor chip is formed to be thicker at an edge part than at other parts in order to prevent a chip conductor part from being exposed even when the insulating film is damaged at the edge part. CONSTITUTION:A bonding pad 2 is constituted by one part of an aluminum wiring part formed on an upper face of a semiconductor chip 1; one end of a bonding wire 3 is connected to this pad. In addition, the other end of this bonding wire 3 is connected to one part of an external extraction lead 4 whose tip part protrudes to the outside of a package; by this setup, the bonding pad 2 is connected electrically to the lead 4. In addition, and insulating film 5 is formed to be thicker at an edge part 1a of the semiconductor chip 1 than at other parts. That is to say, when the semiconductor chip is in a state of a wafer, a recessed part 12 is formed in a part to be scribed of the wafer 11; a first insulating film 13 is formed in this recessed part 12; an insulating film 14 is formed on the film; the insulating films 13, 14 in this part are made thick. |
