| 摘要 |
PURPOSE: To release a tension from a semiconductor wafer through elasticity by having two rows each consisting of a large number of a projection formed to an upper face of an upper cover and members provided to a backside of the upper face to depress the wafer elastically, and engaging the upper cover and the main body so as to open the package from both side faces. CONSTITUTION: Hook parts 76, 82 are engaged with latch parts 41, 43 with friction. In this case, a wafer carrier 16 and a plurality of wafers 92a-92n are contained in a main body 12 and an upper cover 14 being components of the packade. Wafer contactors 84a-84n and 86a-86n lightly press a prescribed position at each circumferential ridge of the wafers 92a-92n and allows the wafers 92a-92n to take a seat onto a wafer carrier 16. Moreover, a pressing force from the wafer contactors 84a-84n and 86a-86n is delivered to the wafer carrier 16 via the wafers 92a-92n, and the carrier 16 is fixed to the main body 12 of the package. |
