| 摘要 |
<p>PURPOSE:To improve the heat dissipation properties of the title device and to facilitate the mounting of the device to a printed wiring board and so on by a method wherein the pitch between leads of first external connecting lead groups is set narrower than the pitch between leads of second external connecting lead groups. CONSTITUTION:A hybrid integrated circuit device has a circuit board 1 with a wiring circuit formed thereon; electric elements 2 and 3, which are placed on the board 1 and have a heat generation property; first external connecting lead groups 8, each consisting of a plurality of external connecting leads which are connected electrically with these electric elements; and second external connecting lead groups 10, each consisting of a plurality of external connecting leads which are electrically connected with the wiring circuit. In this case, the pitch between leads of the first groups 8 is set narrower than the pitch between leads of the second groups 10. Thereby, even though a heat is evolved by electric elements having a heat generation property such as the high-power element 2 and the bare chip IC 3, the heat dissipation properties of the circuit device is good because these semiconductor elements are connected to the first external connecting lead groups having a pitch between leads narrower than the pitch between leads of the second external connecting lead groups.</p> |
