CUTTER FOR SEMICONDUCTOR SINGLE-CRYSTALLINE BAR

摘要

PURPOSE:To detect an accurate warp without being affected by facial deviation of an inner circumferential blade, by a method wherein a distance between the inner circumferential blade and a fixed position facing upon the same is detected synchronously with detecting timing of a mark put down on a fixed position of the inner circumferential blade. CONSTITUTION:A distance sensor 2 provided on a fixed position facing upon a blade 1 puts out an analog signal by detecting a distance between the distance sensor 2 and a blade 1 continuously. A detected signal including a facial deviation of the blade 1, a warp and a ripple ingredient of a power source noise is treated by a sensor amplifier 3 and sensor position detecting part. The detected signal decides that in which state out of the five stages the detected distance exists by comparing in order the detected distance between the blade 1 corresponding to contents of the detected signal and the distance sensor 2 with a predetermined reference value in five stage. Luminous indication of a decision result is performed by an indicator 6 according to a display signal through the sensor position detecting part 4.