| 摘要 |
<p>PURPOSE:To lower a 'rejecting' phenomenon and to improve filling performance, reliability, and working performance, by solidifying a printed frame which is B-staged beforehand on a printed substrate, and by mounting electronic components inside this printed frame and by leaving metallic thin wires connected and filling the printed frame with a sealing member to unite the printed frame with the sealing member. CONSTITUTION:A printed frame 15 is B-staged on a printed substrate by a method such as silk printing or, stamping, and it is solidified beforehand with resin in a prescribed shape at a normal temperature or at a temperature of 80 deg.C or so. Next a semiconductor element 11 is mounted on a printed substrate 12 inside this printed frame, and metallic wires 14 are used to connect guide electrodes with conductive terminals 13a of conductors 13. Next the printed frame 15 is filled with a sealing member 16 of resin. In this case the printed frame 15 is heated again at 80-150 deg.C to be softened to unite the printed frame 15 with the sealing member 16. Accordingly all corner parts of the peripheral surface of the semiconductor element 11 on the printed frame 15, as well as the sealing member, are filled thoroughly with resin, and so the semiconductor element 11 and the metallic thin wires 14 are sealed to improve filling efficiency.</p> |
