| 摘要 |
<p>PURPOSE: To make two metal layers boundable for an integrated circuit die by providing first and second conductive metal layers having one or more metal leads and flexible dielectric layer and providing one of the metal layers with one or more metal leads and metal bus pattern. CONSTITUTION: The assembly comprises a first conductive metal layer 10, having one or more metal leads 14, 18 to be electrically connected to an integrated circuit die 60, a flexible dielectric layer 30 to be mounted on at least a part of the metal layer 10, and a second conductive metal layer 40 having one or more leads 48 to be electrically mounted on the die 60. A metal layer 21 has one or more metal leads 28, to be electrically mounted on the die 60 and at least a metal bus pattern 22. This enables the interconnection of the two metal layers 10, 40 and the integrated circuit die 60.</p> |
