发明名称 CUTTER FOR SEMICONDUCTOR SINGLE-CRYSTALLINE BAR
摘要 PURPOSE:To detect an accurate warp without being affected by facial deviation of an inner circumferential blade, by a method wherein a distance between the inner circumferential blade and a fixed position facing upon the same is detected synchronously with detecting timing of a mark put down on a fixed position of the inner circumferential blade. CONSTITUTION:A distance, sensor 2 detects continuously a distance between the same and a blade 1 facing upon the same and puts out an analog detected signal. The detected signal is comprised of a facial deviation of the blade 1, a warp and analog data containing a ripple ingredient of a power source noise. The title cutter enables a sensor position detector 4 to detect the detected distance between the blade 1 and distance sensor 2 corresponding to the content of the detected signal in five stages, apply display signals corresponding to the detected results to an indicator 6 one after another and confirm if a fixed position of the distance sensor 2 during cutting operation is accurate.
申请公布号 JPS6436406(A) 申请公布日期 1989.02.07
申请号 JP19870192472 申请日期 1987.07.31
申请人 MITSUBISHI METAL CORP 发明人 KUBODERA YUTAKA;AKIYAMA KAZUNARI
分类号 B28D5/02;B23D47/00;B28D5/00 主分类号 B28D5/02
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