| 摘要 |
PURPOSE:To improve the adhesiveness between the inner layer material and the resin layer and hydrochloric acid resistant properties of a multilayer printed wiring board by a method wherein the chlorine ion concentration of the resin of the inner layer material and the resin layer is specified and, after the inner layer material is etched to form a circuit, the surface of the circuit is subjected to an oxidation treatment and then a coupling agent treatment. CONSTITUTION:The chlorine ion concentration of the resin of an inner layer material and a resin layer is specified to be 0-0.05%. After the inner layer material is etched to form a circuit, the surface of the circuit is subjected to an oxidation treatment and then a coupling agent treatment. If the chlorine ion concentration exceeds 0.05%, hydrochloric acid resistant properties are deteriorated. The coupling agent treatment is carried out in such a manner that the inner layer material is dipped into the coupling agent solution and then heated to a required temperature. With this constitution, the adhesiveness between the inner layer material and a resin layer and the hydrochloric acid resistant properties can be improved. |
