| 摘要 |
PURPOSE:To prevent the outflow of an encapsulating agent into a compressing region between the main surface of a semiconductor pellet and an electrode post, when the encapsulating is filled, by providing a gap between the terminating part of a first insulator inner than a part in contact with the main surface of the pellet and the main surface of the pellet. CONSTITUTION:A semiconductor pellet 2 has P-N junctions 2b and 2c. A protruding part 11d is an annular insulator and brought into contact with a main surface 2d of the pellet 2 along the inner part of the periphery of the main surface 2d of the pellet 2. The part 11d faces and surrounds a side wall 2a of the pellet 2. the protruding part 11d is provided in a first insulator 11. A part between the pellet 2 and the first insulator 11 is filled with a second insulator 13. A gap 11a is provided between the terminating part of the first insulator 11 inner than a part 11c in contact with the main surface 2d of the pellet 2 and the main surface 2d of the pellet 2. A space 11b, which is filled with a sufficient amount of the second insulator 13, is provided between the pellet 2 and the first insulator 11. For example, GTO is used as said semiconductor pellet. The first insulator 11 comprises annular silicone rubber. |
