| 摘要 |
PURPOSE:To stabilize the operation of a semiconductor element to be mounted even in high speed operation, by forming a part or all of the leads of a semiconductor package having the leads, on which the semiconductor element is mounted, with resistors. CONSTITUTION:A semiconductor element 2 is mounted on a semiconductor package having leads. In this package, a part or all of the leads 5 and 6 are formed with resistors. For example, the semiconductor package is constituted with the following parts in correspondence with the semiconductor element 2: a package base 1; lead conductor films 3-1-3-4; bonding wires 4-1-4-3; resistor leads 5-1-5-2, conductive leads 6-1-6-4; and pads 7. In this way, ringing in output waveforms in high speed operation can be effectively suppressed. Termination of transmitting paths is performed in the vicinity of the semiconductor package, and mismatch due to reflection is prevented. The number of external resistors is decreased, while the number of parts is also decreased. Therefore, economy is enhanced, and the packaging density can be increased. |
