| 摘要 |
<p>PURPOSE:To prevent the water-runout on the surface of a semiconductor wafer by delivering a first carrier housing the semiconductor wafer under the state, in which the inside of a water tank is filled with water, and transferring semiconductor wafer to a second carrier. CONSTITUTION:When the inside of a pure water tank 2 is supplied with pure water from a supply pipe 3, pure water overflows the pure water tank 2, and is received by an overflow receiver 4, and flows out of an outflow pipe 5. When an arm member 18 as a lifting member is lowered by a motor and a carrier 22 housing a semiconductor wafer 52 is brought down, the semiconductor wafer 52 is received by a wafer receiver 24. Wafer holding members 50, 51 for arm members 48, 49 as sub-moving members are closed and the semiconductor wafer 52 is held, and the arm members 48, 49 are shifted upward and to the right, and lowered and received by a wafer receiver 25. The wafer holding members 50, 51 are opened, a base plate 21 is lifted, and the semiconductor wafer 52 is housed in a carrier 23.</p> |
