| 摘要 |
A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: <IMAGE> wherein R1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic monoazide compound [III] having no substituent or having a neutral or acidic substituent. This composition has a highly improved radiation sensitivity and the sensitive wavelength region of this composition is very broad. This composition can give a highly heat-resistant relief pattern with a good edge sharpness. Heat-resistant relief patterns obtained from this composition are especially useful as insulating passivation or protective coatings in semiconductor devices. |
