发明名称 LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE AND MANUFACTURE OF OPTICAL SEMICONDUCTOR DEVICE USING SAID LEAD FRAME
摘要 PURPOSE:To obtain a lead frame capable of being used for different circuits in common by unifying and connecting an inner lead section with a lead for loading a light-emitting element and an outer lead section with a lead for external connection by a tie bar and arbitrarily selecting the cutting section of the tie bar. CONSTITUTION:Leads 13, 14 being rectangularly extended from a lead fitting section 11 and having pads 15, 16 are unified and connected by a tie bar 17, and a third lead 18 connected to the fitting section 11 and leads 20, 22 having pads 19, 21 on the side reverse to the fitting section 11 are disposed to the bar 17. When a circuit directly connecting two LEDs is manufactured at that time, light-emitting diode pellets 24, 25 are fixed and mounted to the pads 19, 21, an electrode on the pellet 24 and the pad 21 for the lead 22 are connected by a bonding wire 26 while an electrode on the pellet 25 and the pad 16 are connected by a bonding wire 26, and the leads are cut by broken line sections.
申请公布号 JPS6432688(A) 申请公布日期 1989.02.02
申请号 JP19880139553 申请日期 1988.06.08
申请人 TOSHIBA CORP 发明人 FUKUDA IKUO
分类号 H01L33/52;H01L33/62 主分类号 H01L33/52
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